Wafering

Freiberger's wafer slicing and edge rounding technologies are designed for both high efficiency and optimum flexibility. These processes enable us to meet our customers' requirements for off-orientation, wafer thickness, edge profile and various other parameters. Using sophisticated sawing and etching techniques allows us to achieve the excellent global parameters for which Freiberger is well known.

Our two-step polishing process can provide double side as well as single side polished wafers with the same excellent geometrical parameters and surface condition. The polished wafer surface is the most critical feature of our products. Consequently every wafer undergoes a comprehensive final cleaning, inspection and characterization process.